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Ascent DMS Pulsed and DC Power System
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Advanced Dual-Magnetron Sputtering Accessories
The Ascent® DMS series offers unprecedented power-delivery ease and control for dual-magnetron sputtering, enabling precise tuning of film characteristics. With selectable frequency, regulation mode, and duty cycle, as well as low stored energy and simplified, modular system configuration, the Ascent DMS accessory distinguishes itself as truly next-generation technology. Cost-effective, scalable, and versatile, it minimizes complexity, increases quality, and boosts throughput to enable advanced process innovation. The Ascent DMS MF-120 package provides cost-effective, mid-frequency power for standard cathodes, while delivering bipolar pulsing technology benefits.
Features
- Modular and scalable (40, 60, and 120 kW models configurable up to 180 kW)
- Selectable frequency (500 Hz to 50 kHz)
- Adjustable duty cycle — independent power ratio regulation for each magnetron
- Advanced process management through a tiered approach to arc mitigation
- CEX (phase synchronization)
Benefits
- Increased film value: Repeatable, customizable deposited films
- Lower cost of ownership and increased productivity
- Higher power levels with improved stability and reduced arc damage
- Easy scalability, integration, and support
- Modular design allows you to pay for only what you need while enabling future capability expansion
Specifications
| Cooling: | Hybrid (air and water) |
|---|---|
| Output Frequency (MHz, kHz): | 0.5 to 50 kHz |
| Input Voltage (V): | 100 to 240 VAC |
| Power Level (kW): | 40 to 120 kW |
| Rack Width: | Full rack |
| Height (Inches): | 6U, 10U |
| Output Voltage Range (V): | 400-1000 V |
| Communications Interface: | Ethernet, EtherCAT, DeviceNet, Profibus, RS-232/485, EtherNet/IP, and analog communications |
Featured Resources
Ascent® DMS Brochure
The Ascent® DMS series offers unprecedented power delivery ease and control for dual-magnetron sputtering, enabling precise tuning of film characteristics.
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Optimizing Static Deposition Processes White Paper
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Optimizing Glass Process Stability, Throughput with the PowerInsight by Advanced Energy™ IoT Solution
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Substrate Biasing for Sputter Deposition Processes
Explore the principles and practices of substrate biasing, examining its impact on thin-film characteristics and the various methods used to achieve optimal results.
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Technical Documentation
Product Information Documents
Insights & Studies
New
Technical Videos
Exclusive Dynamic Reverse Pulsing Technology for Plasma Power
Oct 18, 2024
Dynamic Reverse Pulsing (DRP) is an AE patented power deliver configuration for coating large-area substrates that is exclusive to AE plasma power products. See how DRP provides synchronous power delivery to increase throughput and flexibility of coating systems.
Learn more:
• Ascent AMS II Pulsed and DC Power System: https://www.advancedenergy.com/en-us/products/plasma-power-products/pulsed-and-dc-power-systems/ascent-ams-ii/
• Ascent DMS Pulsed and DC Power System: https://www.advancedenergy.com/en-us/products/plasma-power-products/pulsed-and-dc-power-systems/ascent-dms/
• Ascent AP Pulsed and DC Power System: https://www.advancedenergy.com/en-us/products/plasma-power-products/pulsed-and-dc-power-systems/ascent-ap/
• Glass: https://www.advancedenergy.com/en-us/applications/industrial/manufacturing/glass/
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