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Ascent AMS II Pulsed and DC Power System
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Stable, Repeatable Power | Water Cooling | Embedded IoT intelligence
New materials and cathode designs increasingly challenge process stability and film repeatability. At the same time, larger deposition areas heighten power requirements and potential arc-related damage. Ascent® AMS II provides stable, repeatable power regardless of process setup or conditions. Its Arc Management System™ (AMS) technology and onboard, embedded IoT intelligence maximize productivity and throughput. This low-noise, water-cooled design with expanded operating range also increases reliability, process capability, and installation flexibility.
Features
- Water cooling
- Modular and scalable
- Embedded PowerInsight by Advanced Energy™ IoT intelligence
- Wide mains voltage range
- Expanded operating range
- Arc Management System™ (AMS) technology — customer pre-sets for metal and ceramic targets
- Set Point Compensation™ technology
- Arc-Sync™ technology — primary/secondary up to 12 units
- Ethernet, EtherCAT®, Profibus, RS-232/485, Ethernet/IP, and analog communications
Benefits
- High film quality and throughput
- Reduced film, substrate, and equipment damage
- Stable throughput and power delivery
- Easy integration and control
- Fast scaling to achieve high power levels
Specifications
| Cooling: | Water |
|---|---|
| Input Voltage (V): | 360 to 528 VAC, 50/60 HZ |
| Power Level (kW): | 60 kW |
| Rack Width: | 19" Full rack |
| Height (Inches): | 6U |
| Output Voltage Range (V): | Up to 1000 V |
| Communications Interface: | Ethernet, EtherCAT, Profibus, RS-232/485, EtherNet/IP, and analog |
| Advanced Features: | Embedded PowerInsight by Advanced Energy™ IoT intelligence |
Featured Resources
Ascent® AMS II Brochure
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Ascent® DMS Brochure
The Ascent® DMS series offers unprecedented power delivery ease and control for dual-magnetron sputtering, enabling precise tuning of film characteristics.
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Optimizing Static Deposition Processes White Paper
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Substrate Biasing for Sputter Deposition Processes
Explore the principles and practices of substrate biasing, examining its impact on thin-film characteristics and the various methods used to achieve optimal results.
View Resource
Technical Documentation
Product Information Documents
Insights & Studies
New
Technical Videos
Exclusive Dynamic Reverse Pulsing Technology for Plasma Power
Oct 18, 2024
Dynamic Reverse Pulsing (DRP) is an AE patented power deliver configuration for coating large-area substrates that is exclusive to AE plasma power products. See how DRP provides synchronous power delivery to increase throughput and flexibility of coating systems.
Learn more:
• Ascent AMS II Pulsed and DC Power System: https://www.advancedenergy.com/en-us/products/plasma-power-products/pulsed-and-dc-power-systems/ascent-ams-ii/
• Ascent DMS Pulsed and DC Power System: https://www.advancedenergy.com/en-us/products/plasma-power-products/pulsed-and-dc-power-systems/ascent-dms/
• Ascent AP Pulsed and DC Power System: https://www.advancedenergy.com/en-us/products/plasma-power-products/pulsed-and-dc-power-systems/ascent-ap/
• Glass: https://www.advancedenergy.com/en-us/applications/industrial/manufacturing/glass/
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