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Ascent AMS Pulsed and DC Power System
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Stable Power Delivery for Extreme Arc Conditions and Highly Repeatable Films
As manufacturing techniques advance, new materials and cathode designs pose greater challenges to process stability and film repeatability. Ascent® AMS power supplies deliver stable, repeatable power, regardless of process material or cathode design. The AMS provides advanced arc management, allowing maximum power delivery with faster recovery to process. Extreme fast recovery also means extremely low energy delivered through arcs, preventing substrate damage. For high power applications, the Ascent AMS can be used in primary/secondary configuration. Common applications include output configurations over 100 kW. However, the combined water/air cooling design keeps the generator footprint to a minimum.
Features
- Arc Management System™ (AMS) technology — customer pre-sets for metal and ceramic targets
- Set Point Compensation™ technology
- Arc Sync® technology — primary/secondary up to 12 units
- Ethernet, EtherCAT®, DeviceNet®, Profibus, RS-232/485, Ethernet/IP, and analog communications
Benefits
- Obtain high film quality and throughput
- Reduce film, substrate, and equipment damage
- Achieve stable throughput and power delivery under extreme arcing conditions
- Easily integrate and control
Specifications
| Cooling: | Hybrid (air and water) |
|---|---|
| Output Frequency (MHz, kHz): | 0.5 to 5 kHz |
| Input Voltage (V): | 400, 440, 480 VAC |
| Power Level (kW): | 30 to 60 kW |
| Rack Width: | Full rack |
| Height (Inches): | 6U |
| Output Voltage Range (V): | 400-1000 V |
| Communications Interface: | Ethernet, EtherCAT, DeviceNet, Profibus, RS-232/485, EtherNet/IP, and analog communications |
Featured Resources
Ascent® AMS Brochure
Ascent® AMS power supplies deliver stable, repeatable power, regardless of process material or cathode design.
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Optimizing Glass Process Stability, Throughput with the PowerInsight by Advanced Energy™ IoT Solution
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Optimizing Static Deposition Processes White Paper
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Substrate Biasing for Sputter Deposition Processes
Explore the principles and practices of substrate biasing, examining its impact on thin-film characteristics and the various methods used to achieve optimal results.
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