Resource Library
White papers, data sheets, videos, etc. — they’re all here. Search by type, solution, and/or product category.
Data Sheets
Ascent AP Data Sheet
Ascent AP provides unprecedented power control for single- and dual-magnetron sputtering.
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Data Sheets
Pinnacle Diamond Data Sheet
Pinnacle DC generators enable quality thin films and maximum process efficiency, with power options from 6 to 20 kw. They produce the best films possible with accurate, repeatable power and leading, low-delivered ARC energy.
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Data Sheets
Pinnacle 3000 Data Sheet
Industry-Leading Pinnacle DC Power Technology in a 3000 W Package: Robust, compact DC generator designed exclusively for low power applications where precision and process repeatability are critical.
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Data Sheets
Pinnacle Plus Data Sheet
Process-Proven, Pulsed DC for Single-Magnetron Reactive Sputtering of Thin Dielectric Films: Pinnacle Plus+ generators deliver DC power in a pulsing configuration enabling reactive sputtering of extremely uniform, high-quality dielectric films.
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Data Sheets
Solvix Arc Bias Data Sheet
The Solvix arc-bias solution brings a new level of precision and productivity to cathodic arc processes and provides superior film quality.
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Data Sheets
Ascent AMS Data Sheet
Ascent AMS provides stable power delivery through extreme arc conditions for highly repeatable films.
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White Papers
Embracing Design for Reliability White Paper
Learn how industry trends drive demand for increased quality and capacity as well as the Design for Reliability (DfR) process.
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Data Sheets
Ascent DMS Data Sheet
The Ascent DMS series offers unprecedented power delivery ease and control for dual-magnetron sputtering, enabling precise tuning of film characteristics.
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Data Sheets
PEII Series Data Sheet
PEII Series provides enhanced arc control with internal load matching for 40 kHz reactive sputtering applications.
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Articles
Dynamic Reverse Pulsing 2.5: Solving critical roadblocks in thin-film coating technologies
This article discusses issues thin-film coating professionals encounter with reactive sputtering and how dynamic reverse pulsing (DRP) power configurations eliminated many of those challenges.
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