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eVoS LE Bias Solution
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Asymmetric Bias Waveform Generator for Direct Control of Substrate Voltage and Ion Energy
The eVoS® LE is an asymmetric bias waveform generator designed to achieve direct control of wafer-surface voltage and resulting ion energy distributions (IED) in plasma-based etch and deposition processes. The eVoS system consists of a bi-directional voltage supply combined with an independent current source to establish and control wafer-surface potential. The asymmetric output of the eVoS eliminates the limitations and restrictions of wafer biasing inherent to sinusoidal RF bias application. Fast digital metrology and novel control algorithms enable the production of near mono-energetic IEDs. Use additional parameters for customizing average and time-varying aspects of the wafer surface voltage and resulting ion energy distribution.
特点
- Ability to produce near mono-energetic ion energy distributions
- Pulse capability with necessary input and output signals for synchronization
- Integrated design and compact size eliminates need for matching network
- High-speed metrology provides real-time bias voltage and ion current feedback
- Narrow, broad, and multi-peak distributions
- Adaptable to standard chamber interface
益处
- Achieve direct control of wafer bias voltage and resulting ion energies
- Gain enhanced ion energy selection/discrimination when compared to a RF bias method
- Significantly increase etch selectivity for shorter processes and straighter, deeper features
- Use less power by using the “right power,” only delivering the useful ion energy
- Simplify bias power integration
规格
| 冷却: | Hybrid (air and water) |
|---|---|
| 输出频率（兆赫、千赫）: | 400 kHz |
| 输入电压 (V): | 185 to 260 VAC |
| 机架宽度: | Chamber Mount and Full Rack |
| 输出电压范围 (V): | 2250 V |
| 通信接口: | EtherCAT, Ethernet |
| 流程应用: | Etch |
| 峰值电流（安）: | 1.4 |
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